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TECHNOLOGY

PECVD
(Plasma Enhanced Chemical Vapor Deposition)

When using a PECVD-process, as with CVD (Chemical Vapor Deposition), only gases are used. For PECVD the deposition temperatures are considerably lower (100–600 °C) compared to the classical CVD with temperatures in the rage of 1000 °C and higher. The plasma is used to enforce the reaction  as well as the dissociation of the reactive gases, such as C₂H₂ or CH₄ during the deposition of DLC (Diamond Like Carbon) coatings.

Also combinations of processes such as

are used.

To deposit well adherent DLC-coatings adhesive layers have to be deposited prior forming DLC. Cr (Chromium), deposited by arc evaporation, is an excellent candidate to improve the adhesion of DLC.

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